Component dosage / g component dosage / g
E-51 epoxy resin 100600# epoxy thinner 10
650# polyamide 20 imidazole 8
D-17 polybutadiene epoxy resin 20β-hydroxyethyl ethylenediamine 8
Preparation and curing are weighed according to the amount, and evenly mixed. The adhesive pressure of this product is 0.07~0.15MPa. Curing at 100 ° C for 3 h or 60 ° C for 4 h.
Use This gel can be used for a long time at 100 ° C. It has excellent water and aging resistance and is used for metal and non-metal bonding.
FOSHAN CITY KURUI LIGHTING CO.,LTD , https://www.kuruilighting.com